IC package converters and adapters are electronic interconnect devices that are used to interface different types of integrated circuit (IC) sockets. Types of IC Package Converters and Adapters ...

Bonding Die bonding is the attachment of IC chips or dies using an adhesive into a package. Back Grinding Thinning of dies or chips using back grinding processes to improve thermal dissipation and ...

One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the ...

Innovative IC substrate manufacturer Phoenix Pioneer Technology is undergoing a strategic transformation into advanced ...