Solder joint faults can be described with a single word – pernicious. Solder joints connect the BGA package, containing an FPGA (Field Programmable Gate Array) core, to the PCB (Printed Circuit Board) ...
Imagine you’re out behind enemy lines in WW2, setting up demolition charges that may save the lives of your fellow soldiers. How do we make a solid connection between wires that will last? One of the ...
One of the most significant challenges in the electronics industry is the formation of voids in solder joints. Voiding typically occurs when flux or solvent in the paste becomes trapped in the joint, ...
In 1999, Stig Oresjo, then of Agilent Technologies, conducted a major study of solder-joint defects on printed-circuit boards (PCBs). The study, which at the time provided the most definitive data on ...
In conjunction with the release of its latest soldering procedure, the Mechanical Contractors Association of America’s (MCAA’s) National Certified Pipe Welding Bureau (NCPWB) encourages contractors to ...
Solder joint faults can be described with a single word – pernicious. Solder joints connect the BGA package, containing an FPGA (Field Programmable Gate Array) core, to the PCB (Printed Circuit ...
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