To meet its quality control roadmap goals by 2010, researchers at the National Institute of Standards and Technology (NIST) developed the Improved Interferometer To meet its quality control roadmap ...
“Three-dimensional (3D) semiconductor devices can address the limitations of traditional two-dimensional (2D) devices by expanding the integration space in the vertical direction. A 3D NOT-AND (NAND) ...
The instrument displays 20, 60, and 85° readings for high-gloss to matte finishes. Its Fe/NFe (magnetic/ nonmagnetic) sensor measures thickness (0 to 1,000 μm) on steel as well as aluminum, and it ...
Seidenader’s automatic DS12+ thickness sorting machine has been re-designed for more user-friendly handling and lower maintenance. Additional practical design details and a touchscreen (HMI) have ...
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